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JDF-651 is a low-viscosity, solvent-free reactive polyamide resin developed by Polymeric. It is based on dimer fatty acids and polyamines to provide tough, high-temperature curing of liquid solid epoxy resin coatings at room temperature. Chemical corrosion properties of the resin material. Compared to other standard reaction polyamide JDF-650, JDF-651 has better chemical and solvent resistance, and JDF-651 has a lower viscosity than JDF-300.

Product Features：

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◆ Compression and tensile strength.

◆ Good adhesion.

◆ Water resistance, good corrosion resistance.

◆ good dielectric properties.

The main technical and performance parameters:

①：HCl Determination

Applications:

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◆ pouring, potting and encapsulation.

◆ high filler or thick slurry type coating.

◆ Adhesive.

Packaging, transportation and storage:

1, the packaging has 1kg, 18kg, 190kg specifications packaging.

2, the transport process should be rain, sun, to prevent damage to the packaging, moisture.

3, stored in a cool dry place, away from fire, strong acid, alkali and strong oxidants.

4, in accordance with the provisions of the transport and storage conditions, from the date of production from the storage period of 12 months.

5, curing agent for non-dangerous goods, can be disposed of as a general merchandise.

6, the color is gradually deepening during storage is a normal phenomenon, does not affect the use of results. Curing agent drums should be closed after the use of lid tightly closed to avoid long-term exposure to air.

Our product information is complete and reliable, but given the variety of product application conditions variability, if the company's products applied to any particular occasion, should be pre-tested and evaluated.